Semiconductor & Micro-Electronics

Semiconductor process and metrology tools need ultra-flat wafers, low-defect substrates and stable coatings. We deliver glass and quartz components with semiconductor-grade cleanliness and tolerances.

Application products

Typical equipment and systems in this field:

Lithography & inspection tools

Illumination and imaging optics.

Wafer metrology & review

Transmission windows and reference flats.

Process equipment (dep & etch)

Viewports and insulating substrates.

Packaging & test systems

Carrier glass and alignment targets.

MEMS & sensor fabrication

Wafer-level substrates and capping glass.

Optical components we supply

Made or coated to your drawing — click any item to view the product family:

Fused silica and sapphire windows for semiconductor process equipment

What this application demands

Semiconductor process and metrology equipment imposes requirements that are closer to a cleanroom consumable than to an optical component. Particle cleanliness, outgassing, dimensional stability and flatness are often what the tool engineer worries about; the transmission curve may already be fixed by the process wavelength and simply has to be held repeatably from lot to lot.

UV transmission is the other defining requirement. As process wavelengths move deeper into the ultraviolet, the choice of substrate narrows sharply — ordinary borosilicate stops transmitting where the process needs to work, and only UV-grade fused silica or sapphire will do. Flatness matters in metrology because the reference surface defines the measurement, not just the image.

Specifications we recommend

ComponentTypical specificationWhy
Viewport and process windowsUV-grade fused silica, low OH, tight thickness toleranceTransmits the process wavelength without solarisation or absorption losses
Carrier and support wafersBorosilicate or display glass, TTV below 3 µmFlatness controls the uniformity of the process above it
Metrology reference platesPolished fused silica, flatness to λ/10, verified interferometricallyThe reference surface defines the accuracy of the instrument
Inspection opticsBroadband AR coatings on glass and quartzHigh transmission for defect review without adding ghost images

Failure modes we design against

Particle contamination arriving with the optic is the most common cause of a rejected part in this sector, which is why we clean and pack to a protocol rather than as a final step. Surface haze and water marks show up immediately in dark-field inspection and are prevented by controlled rinsing and drying rather than by additional polishing.

Mechanical stability is the second concern. Where a window is clamped into a tool and cycled thermally, small thickness or flatness variation translates directly into optical variation. Holding thickness tolerance tightly at the start is cheaper than compensating for it in the tool.

If your incoming inspection includes particle counting or outgassing limits, send the criteria with the enquiry. Packaging and cleaning are specified against them rather than assumed.

Frequently asked questions

Can you supply UV-grade material for deep-UV windows?

Yes — UV-grade fused silica with low OH content is the standard route, with sapphire where hardness or mid-IR transmission also matters.

Is wafer-level flatness achievable on coated parts?

Coating adds a small figure contribution. We measure wavefront or flatness after deposition, which is the number that governs performance in the tool.

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